Our list
of satisfied customers who have come to us for electronic packaging,
product development and electro mechanical design and documentation
continues to grow. See the services and areas served below.
Since 1993 Technisys has provided:
Product development, documentation, electronic packaging, autocad design and
documentation, circuit board design, FPGA design, prototype development, analog
and digital electronic product development and signal interface and conversion
for optical and electrical applications including passive and active electronic
products.
We have worked with clients in the Delaware Valley, Pennsylvania, including Philadelphia,
New Jersey, including South Jersey, Southern New Jersey, Central New Jersey,
New York, Colorado, Ft. Meade, Maryland, California,
NASA in Florida, and many other locations throughout the world.
Our Expertise:
• Electronic packaging for hardware applications
• Electronic product development and design for custom hardware solutions
• Electronic engineering-hardware and software
• Software development for specialized applications
• General Industry packaging and design
• Integrated design and system integration enhancement
• PCB design including FPGA and ethernet enabled development
• Circuit board design
• Mechanical design and Electromechanical design and development
• Documentation using Autocad design for complete rack systems
• Project management
• Electronic component sourcing and project administration
• Reengineering of legacy products
• Signal Interface and conversion hardware
• Passive interface hardware including patch panels
• Data Storage and retrieval hardware
• STM 64 Expertise
• Analog and digital hardware packaging and development
Give us a call to discuss your next packaging
project. Why reinvent it? Call us to review our portfolio
of engineered electronic packaging and product development hardware.
Also inquire about samples or quotes for your documentation or
electromechanical design.Call 856-848-9001or 800-305-9001 or
email engineering@tsys-inc.com
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